NXP Semiconductors
PEMD48; PUMD48
NPN/PNP resistor-equipped transistors
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
PEMD48 (SOT666)
PUMD48 (SOT363)
Per device
Rth(j-a)
thermal resistance from
junction to ambient
PEMD48 (SOT666)
PUMD48 (SOT363)
Conditions
Tamb ≤ 25 °C
Tamb ≤ 25 °C
Min Typ Max Unit
[1][2] -
-
625 K/W
[1] -
-
625 K/W
[1][2] -
-
416 K/W
[1] -
-
416 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
PEMD48_PUMD48_5
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 13 April 2010
© NXP B.V. 2010. All rights reserved.
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