PI3012A View Datasheet(PDF) - AMI Semiconductor

Part Name

Description

Manufacturer

PI3012A

300DPI CIS Sensor Chip Engineering Data Sheet

AMI Semiconductor 

™ Peripheral

Imaging

Corporation

PI3012A

300DPI CIS Sensor Chip

Engineering Data Sheet

Description:

Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution

linear array image sensor chip which utilizes PIC’s proprietary CMOS Image Sensing

Technology. This image sensor is to be used for butting end-to-end on a printed circuit board

(PCB) using chip-on-board technology to form a scanning array with various lengths.

Applications for the sensor array are facsimile, scanner, check reader, and office automation

equipment.

Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements,

8080µm

1

23

4 ROW OF 96 SENSORS 93 94 95 96

AND VIDEO SIGNAL

LINE MULTIPLEXER

READOUT SHIFT REGISTER

380µm

BUFFER

SP

BUFFER

CP VDD DGND

CHIP

SELECT

IOUT

PI3012A SENSOR CHIP

FIGURE 1 BLOCK DIAGRAM

BUFFER

EOS

their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element

spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm.

Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.

PAGE 1 of 7 PI3012A6, 6/9/99

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