QT1106 View Datasheet(PDF) - Quantum Research Group
Part Name
Description
Manufacturer
QT1106 Datasheet PDF : 20 Pages
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7.7 Mechanical - 32-QFN Package
Dimensions In Millimeters
Symbol Minimum Nominal Maximum
A
0.70
-
0.95
A1
0.00
0.02
0.05
b
0.18
0.25
0.32
C
-
0.20 REF
-
D
4.90
5.00
5.10
D2
3.05
-
3.65
E
4.90
5.00
5.10
E2
3.05
-
3.65
e
-
0.50
-
L
0.30
0.40
0.50
y
0.00
-
0.075
Note: there is no functional requirement for the large pad on the underside of the
32-QFN package to be soldered to the substrate. If the final application does require this
area to be soldered for mechanical reasons, the pad(s) to which it is soldered to must be
isolated and contained under the 32-QFN footprint only.
7.8 Part Marking
Pin 1 Identification
QT1106
©QRG 8I
YYWWG
run nr.
QRG Part
Number
QRG
Revision
Code
Two lines of text to ensure product traceability:
'YY' = Year of manufacture,
'WW' = Week of manufacture,
'G' = Green/RoHS Compliant,
'run nr.' = Run Number
lQ
19
QT1106-ISG R8I.05/0906
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