RMPA5255 View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
RMPA5255 Datasheet PDF : 7 Pages
| |||
Schematic
RF IN
1
2
50Ω
3
VDET
(P-Sense)
10
9
8
RF OUT
7
50Ω
6
4
5
C1
220pF
C2
0.01µF
C3
2.2µF
Pin
Description
1
GND
2
RF IN
3
GND
4
VPC
5
VCC
6
GND
7
RF OUT
8
GND
9 VDET (P-Sense)
10
N/C
11 CENTER GND
Package Outline
VPC VCC
I/O 1 INDICATOR
1
TOP VIEW
2
3
FRONT VIEW
1.80 TYP.
0.70 TYP.
0.10 TYP.
1.70 TYP.
0.40 TYP.
2
1
BOTTOM VIEW
10
9
4
5
5.00 ±0.10mm
8
NOTES:
7 5.00 ±0.10mm
1. PACKAGE BASE MATERIAL AND
INTERCONNECT METALLIZATION:
BT GRADE CCL-HL832, AuNiCu,
Au 0.38 MICROMETERS MINIMUM.
6
2. SMT EXPOSURE: THIS DEVICE WILL WITHSTAND EXPOSURE TO
TEMPERATURES OF 240°C MAXIMUM FOR DWELL TIME OF
10 SECONDS MAXIMUM.
1.40 ±0.10mm
= EXPOSED METAL CONTACT PADS
1.40 TYP.
0.60 TYP.
0.70 TYP.
2.80 SQ.
525Z5XYTT
1.10 TYP.
Dimensions in mm
RMPA5255 Rev. E
4
www.fairchildsemi.com
Share Link: 