RP103N131D View Datasheet(PDF) - RICOH Co.,Ltd.
Part Name
Description
Manufacturer
RP103N131D Datasheet PDF : 20 Pages
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RP103
POWER DISSIPATION (SC-82AB)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on
board. This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
Free Air
380mW
150mW
θja=(125−25°C)/0.38W=263°C/W
667°C/W
600
500
400 380
On Board
300
200 150
100
Free Air
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
40
Measurement Board Pattern
IC Mount Area (Unit : mm)
TYPICAL CHARACTERISTICS
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