RT9001
Where TJ(MAX) is the maximum junction temperature of the
die (125°C) and TA is the ambient temperature. The junction
to ambient thermal resistance (θJA) for SOT-223 package
at recommended minimum footprint is 160°C/W (θJA is
layout dependent). Visit our website in which
“Recommended Footprints for Soldering Surface Mount
Packages” for detail.
www.richtek.com
8
DS9001-04 March 2007