RT9016 View Datasheet(PDF) - Richtek Technology

Part Name

Description

Manufacturer

RT9016

500mA Peak, Thermal Folded Back CMOS LDO Regulator

Richtek Technology 

Preliminary

RT9016

PD(MAX) = ( TJ(MAX) − TA ) /θJA

Where TJ(MAX) is the maximum operation junction

temperature 125°C, TA is the ambient temperature and

the θJA is the junction to ambient thermal resistance.

For recommended operating conditions specification of

RT9016, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (θJA is layout dependent) for SOT-23-5 package

is 250°C/W and WDFN-6L 2x2 package is 165°C/W on

standard JEDEC 51-3 thermal test board. The maximum

power dissipation at TA = 25°C can be calculated by

following formula :

PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT-23-5)

PD(MAX) = (125°C−25°C) / 165 = 606mW V(DFN-6L 2x2)

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA. For RT9016 packages, the Figure 3 of

derating curves allows the designer to see the effect of

rising ambient temperature on the maximum power

allowed.

700

WDFN-6L 2x2

600

500

SOT-23-5

400

300

200

100

0

0

25

50

75

100 125 150

Ambient Temperature (°°C)

Figure 3. Derating Curve for Packages

VOUT Short to GND

VOUT

IOUT

0.4V

TSD

OTP

165 °C

Trip Point

110 °C

110 °C

IC Temperature

80 °C

Figure 2. Short Circuit Thermal Folded Back Protection

when Output Short Circuit Occurs

DS9016-03 August 2007

www.richtek.com

9

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