RTL8181 View Datasheet(PDF) - Realtek Semiconductor

Part Name

Description

Manufacturer

RTL8181

Wireless LAN Access Point/Gateway Controller

Realtek Semiconductor 

Package outline for TFBGA 292 BALL(17*17 mm)

RTL8181

Symbol Dimension in mm Dimension in inch

Min Nom Max Min Nom Max

A

--- --- 1.30 --- --- 0.051

A1 0.25 0.30 0.35 0.010 0.012 0.014

A2 0.84 0.89 0.94 0.033 0.035 0.037

c

0.32 0.36 0.40 0.013 0.014 0.016

D 16.90 17.00 17.10 0.665 0.669 0.673

E 16.90 17.00 17.10 0.665 0.669 0.673

D1

--- 15.20 --- --- 0.598 ---

E1

--- 15.20 --- --- 0.598 ---

e

--- 0.80 --- --- 0.031 ---

b

0.35 0.40 0.45 0.014 0.016 0.018

aaa

0.10

0.004

bbb

0.10

0.004

ccc

0.12

0.005

ddd

0.15

0.006

eee

0.08

0.003

MD/ME

20/20

20/20

1. CONTROLLING DIMENSION : MILLIMETER

2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BALLS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL

DIAMETER, PARALLEL TO PRIMARY DATUM C.

4. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE

EDGE OF THE SOLDER BALL AND THE BODY EDGE.

5. REFERENCE DOCUMENT : JEDEC MO-205.

6. THE PATTERN OF PIN 1 FIDUCIAL IS FOR REFERENCE ONLY.

TITLE : 292LD TFBGA ( 17x17mm) PACKAGE OUTLINE

SUBSTRATE MATERIAL: BT RESIN

APPR.

ENG.

QM.

CHK .

DWG.

REALTEK SEMI-CONDUCTOR CO., LTD

DWG NO..

Rev NO

PRODUCT CODE

DATE.

SHT No.

CONFIDENTIAL

50

v1.0

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