S25FL127S View Datasheet(PDF) - Spansion Inc.
Part Name
Description
Manufacturer
S25FL127S Datasheet PDF : 131 Pages
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S25FL127S
128 Mbit (16 Mbyte) MirrorBit® Flash Non-Volatile Memory
CMOS 3.0 Volt Core
Serial Peripheral Interface with Multi-I/O
Data Sheet (Preliminary)
Features
Density
– 128 Mbits (16 Mbytes)
Serial Peripheral Interface (SPI)
– SPI Clock polarity and phase modes 0 and 3
– Extended Addressing: 24- or 32-bit address options
– Serial Command set and footprint compatible with S25FL-A,
S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
– Normal, Fast, Dual, Quad
– AutoBoot - power up or reset and execute a Normal or Quad read
command automatically at a preselected address
– Common Flash Interface (CFI) data for configuration information.
Programming (0.8 Mbytes/s)
– 256- or 512-byte Page Programming buffer options
– Quad-Input Page Programming (QPP) for slow clock systems
Erase (0.5 Mbytes/s)
– Hybrid sector size option - physical set of sixteen 4-kbyte sectors at
top or bottom of address space with all remaining sectors of
64 kbytes
– Uniform sector option - always erase 256-kbyte blocks for software
compatibility with higher density and future devices.
Cycling Endurance
– 100,000 Program-Erase Cycles per sector minimum
Data Retention
– 20 Year Data Retention typical
Security features
– One Time Program (OTP) array of 1024 bytes
– Block Protection:
– Status Register bits to control protection against program or
erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or password
Spansion® 65 nm MirrorBit Technology with Eclipse™
Architecture
Supply Voltage: 2.7V to 3.6V
Temperature Range:
– Industrial (-40°C to +85°C)
– Automotive In-Cabin (-40°C to +105°C)
Packages (all Pb-free)
– 8-lead SOIC (208 mil)
– 8-contact USON 6 x 5 mm
– BGA-24 6 x 8 mm
– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options
– Known Good Die and Known Tested Die
Publication Number S25FL127S_00
Revision 02
Issue Date April 25, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qual-
ification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document
may be revised by subsequent versions or modifications due to changes in technical specifications.
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