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S29GL016A10BFER22 View Datasheet(PDF) - Spansion Inc.

Part Name
Description
Manufacturer
S29GL016A10BFER22
Spansion
Spansion Inc. Spansion
S29GL016A10BFER22 Datasheet PDF : 89 Pages
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Advance Information
Ordering Information–S29GL064A
S29GL064A Standard Products
Standard products are available in several packages and operating ranges. The
order number (Valid Combination) is formed by a combination of the following:
S29GL064A 90 T A I R1 2
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
R1 = x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address
sector protected when WP#/ACC=VIL
R2 = x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3 = x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address
sectors protected when WP#/ACC=VIL
R4 = x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL
R5 = x16, VCC=3.0-3.6V, Uniform sector device
R6 = x16, VCC=3.0-3.6V, Uniform sector device, highest address sector
protected when WP#=VIL
R7 = x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#=VIL
R8 = x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address
sector protected when WP#=VIL, TSO48 only
R9 = x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#=VIL, TSO48 only
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
E = Engineering Samples (available prior to Production Release only)
PACKAGE MATERIAL SET
A = Standard
F = Pb-Free
PACKAGE TYPE
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL064A, 64 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBitTM
Process Technology, 3.0 Volt-only Read, Program, and Erase
16
S29GL-A MirrorBit™ Flash Family
S29GL-A_00_A3 April 22, 2005

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