Switch Type Multi Control Devices
Soldering Conditions
Multi Control
Devices
Example of Reflow Soldering Condition
1. Heating method:
Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA(K)or CC(T)at solder joints copper foil surface). A heat resistive tape
should be used to fix thermocouple.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Variable
Resistor Type
Switch
Type
Serie( s Reflow type)
RKJXS
SLLB, SLLB5
SKRV/SKRH/SKQUBA,DB/SSAF/SRBE
A(℃)
3s max.
260
240
260
B(℃)
230
C(s)
40
20
40
D(℃)
150
180
E(℃)
150
F(s)
120
Notes
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
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