SL23-M View Datasheet(PDF) - Formosa Technology
Part Name
Description
Manufacturer
SL23-M Datasheet PDF : 2 Pages
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Low VF Chip Schottky Barrier Diodes
SL22-M THRU SL24-M
Formosa MS
Silicon epitaxial planer type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC SOD123 / MINI SMA
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.04 gram
SOD-123
0.161(4.1)
0.146(3.7)
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
0.126(3.2)
0.110(2.8)
0.035(0.9) Typ.
0.063(1.6)
0.055(1.4)
0.035(0.9) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
VR = VRRM TA = 25oC
VR = VRRM TA = 100oC
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
Symbol
IO
IFSM
IR
RqJA
CJ
TSTG
MIN.
-55
TYP.
70
160
MAX.
2.0
UNIT
A
50
A
1.0
10
+150
mA
mA
oC / w
pF
oC
SYMBOLS
SL22-M
SL23-M
SL24-M
MARKING
CODE
SL22
SL23
SL24
VRRM *1
(V)
20
30
40
VRMS *2
(V)
14
21
28
VR *3
(V)
20
30
40
VF *4
(V)
0.38
0.40
0.40
Operating
temperature
(oC)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
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