5962-89807012A View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

5962-89807012A

Balanced Modulator/Demodulator

Analog Devices 

AD630

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V

Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 600 mW

Output Short-Circuit to Ground . . . . . . . . . . . . . . . Indefinite

Storage Temperature, Ceramic Package . . . –65°C to +150°C

Storage Temperature, Plastic Package . . . . . –55°C to +125°C

Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C

THERMAL CHARACTERISTICS

20-Lead PDIP (N)

20-Lead Ceramic DIP (D)

20-Lead Leadless Chip Carrier LCC (E)

20-Lead SOIC (R-20)

␪JC

24°C/W

35°C/W

35°C/W

38°C/W

␪JA

61°C/W

120°C/W

120°C/W

75°C/W

ORDERING GUIDE

Model

AD630JN

AD630KN

AD630AR

AD630AR-REEL

AD630AD

AD630BD

AD630SD

AD630SD/883B

5962-8980701RA

AD630SE/883B

5962-89807012A

AD630JCHIPS

AD630SCHIPS

Temperature Ranges

0°C to 70°C

0°C to 70°C

–25°C to +85°C

–25°C to +85°C

–25°C to +85°C

–25°C to +85°C

–55°C to +125°C

–55°C to +125°C

–55°C to +125°C

–55°C to +125°C

–55°C to +125°C

0°C to 70°C

–55°C to +125°C

Package Description

PDIP

PDIP

SOIC

SOIC 13" Tape and Reel

SBDIP

SBDIP

SBDIP

SBDIP

SBDIP

CLCC

CLCC

Chip

Chip

Package Option

N-20

N-20

R-20

R-20

D-20

D-20

D-20

D-20

D-20

E-20A

E-20A

CHIP METALLIZATION AND PINOUT

Dimensions shown in inches and (millimeters).

Contact factory for latest dimensions.

PIN CONFIGURATIONS

20-Lead SOIC, PDIP, and CERDIP

RINA 1

20 CH A–

CH A+ 2

19 CH B–

DIFF OFF ADJ 3

18 CH B+

DIFF OFF ADJ 4

17 RINB

CM OFF ADJ 5 AD630 16 RA

CM OFF ADJ

6

TOP VIEW

(Not to Scale)

15

RF

CHANNEL STATUS B/A 7

14 RB

–VS 8

SEL B 9

13 VOUT

12 COMP

SEL A 10

11 +VS

20-Terminal CLCC

CHIP AVAILABILITY

The AD630 is available in laser trimmed, passivated chip

form. The figure above shows the AD630 metallization pattern,

bonding pads and dimensions. AD630 chips are available; con-

sult factory for details.

DIFF OFF ADJ 4

CM OFF ADJ 5

CM OFF ADJ 6

CHANNEL STATUS B/A 7

–VS 8

3 2 1 20 19

AD630

TOP VIEW

(Not to Scale)

9 10 11 12 13

18 CH B+

17 RINB

16 RA

15 RF

14 RB

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD630 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

REV. E

–3–

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