ST7632 View Datasheet(PDF) - Sitronix Technology Co., Ltd.
Part Name
Description
Manufacturer
ST7632 Datasheet PDF : 96 Pages
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ST7632
3. ST7632 Pad Arrangement (COG)
Chip Size: 19,550 um × 1,473 um
Bump Pitch: PAD NO 1 ~ 496, 632~663: 40 um (COM/SEG), PAD NO 497 ~ 631: 110 um (I/O)
Bump size:
PAD NO.1~464: 25(x)um X 110(y)um
PAD No.465~496, 632~663: 110(x)um X 25(y)um
PAD N0. 497~631: 90(x)um X 40(y)um
Bump Height: 17um
Chip Thickness: 635 um
Bump size of
PAD 465~496
PAD 632~663
unit: um
110
25
464 463
465
45
30
60
(-7909.1,189.69)
30
unit: um
Y
25
Bump size of
PAD 1~464
110
unit: um
1
663
X
(0,0)
496
497 498
90
40
Bump size of
PAD 497 ~ 631
unit: um
40
81.75
25
40
(-174,-483)
unit: um
632
630 631
30
(9427.36, -645.88)
60
30
45
unit: um
Ver 1.7
2/96
2006/08/15
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