STPS20L45CF/CW/CT/CFP/CG
Fig. 7: Forward voltage drop versus forward
current (maximum values) (per diode).
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm) (D2PAK).
IFM(A)
100.0
Typical values
Tj=150°C
10.0
Tj=125°C
1.0
Tj=25°C
Tj=75°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 4 8 12 16 20 24 28 32 36 40
PACKAGE MECHANICAL DATA
ISOWATT220AB
s Cooling method : C
s Recommended torque value : 0.55 m.N
s Maximum torque value : 0.70 m.N
4/8
REF.
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Diam
DIMENSIONS
Millimeters
Inches
Min. Max.
4.40 4.60
2.50 2.70
2.50 2.75
0.40 0.70
0.75 1.00
1.15 1.70
1.15 1.70
4.95 5.20
2.40 2.70
10.00 10.40
16.00 typ.
28.60 30.60
9.80 10.60
15.90 16.40
9.00 9.30
3.00 3.20
Min. Max.
0.173 0.181
0.098 0.106
0.098 0.108
0.016 0.028
0.030 0.039
0.045 0.067
0.045 0.067
0.195 0.205
0.094 0.106
0.394 0.409
0.630 typ.
1.125 1.205
0.386 0.417
0.626 0.646
0.354 0.366
0.118 0.126