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TAT8857-EB View Datasheet(PDF) - TriQuint Semiconductor

Part Name
Description
Manufacturer
TAT8857-EB
TriQuint
TriQuint Semiconductor TriQuint
TAT8857-EB Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
TAT8857
CATV Doubler Hybrid RFIC
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-compliant. The plating material on the leads is 100% Matte Tin. It is compatible with both
lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
The TAT8857 will be marked with an “TAT8857” designator with a lot code marked below the part designator. The “Y”
represents the last digit of the year the part was manufactured, the “XXXX” is an auto-generated number and “Z” refers to a
wafer number in a lot batch.
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device
can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .xxmm (#xx / .0xxx”) diameter drill and
have a final plated thru diameter of .xx mm (.0xx”).
3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Data Sheet: Rev C 06-05-12
© 2012 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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