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TC4425 View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
TC4425
Microchip
Microchip Technology Microchip
TC4425 Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TC4423/TC4424/TC4425
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ................................................................+22V
Input Voltage, IN A or IN B
................................................ (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA 70°C)
DFN ......................................................................... Note 2
PDIP .......................................................................730 mW
SOIC.......................................................................470 mW
Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V VDD 18V.
Parameters
Sym
Min
Typ Max Units
Conditions
Input
Logic ‘1’, High Input Voltage
VIH
2.4
V
Logic ‘0’, Low Input Voltage
VIL
0.8
V
Input Current
IIN
–1
1
µA 0V VIN VDD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Peak Output Current
Latch-Up Protection With-
stand Reverse Current
VOH
VOL
ROH
ROL
IPK
IREV
VDD – 0.025
2.8
3.5
3
>1.5
0.025
5
5
V
V
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
A
A Duty cycle 2%, t 300 µsec.
Switching Time (Note 1)
Rise Time
Fall Time
Delay Time
Delay Time
Power Supply
tR
23
35
ns Figure 4-1, Figure 4-2,
CL = 1800 pF
tF
25
35
ns Figure 4-1, Figure 4-2,
CL = 1800 pF
tD1
33
75
ns Figure 4-1, Figure 4-2,
CL = 1800 pF
tD2
38
75
ns Figure 4-1, Figure 4-2,
CL = 1800 pF
Power Supply Current
IS
Note 1: Switching times ensured by design.
1.5
0.15
2.5
0.25
mA VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
2: Package power dissipation is dependent on the copper pad area on the PCB.
2004 Microchip Technology Inc.
DS21421D-page 3

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