TCM812TERCTR View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
TCM812TERCTR Datasheet PDF : 16 Pages
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TCM811/TCM812
2.0 TYPICAL PERFORMANCE CHARACTERISTICS
Note:
The graphs provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only. The performance characteristics listed herein are not
tested or guaranteed. In some graphs, the data presented may be outside the specified operating range
(e.g., outside specified power supply range) and therefore outside the warranted range.
14
TCM81xR/S/T/F
12
No Load
10
8
VDD = 5V
6
VDD = 3V
4
VDD = 1V
2
0
–40
–20
0
20
40
TEMPERATURE (˚C)
60
85
FIGURE 2-1: Supply Current vs. Temperature.
50
TCM81xF
40
30
VOD = 20 mV
20
10
VOD = 100 mV
0 VOD = 200 mV
–40
–20
0
20
40
60
85
TEMPERATURE (˚C)
FIGURE 2-2: Power-Down Reset Delay vs.
Temperature.
250
245
TCM81xL/M
240
235
TCM81xR/S/T/F
230
225
–40
–20
0
20
40
TEMPERATURE (˚C)
60
85
FIGURE 2-3: Power-Up Reset Timeout vs.
Temperature.
8
TCM81xL/M
No Load
6
VDD = 5V
4
VDD = 3V
2
VDD = 1V
0
–40
–20
0
20
40
60
85
TEMPERATURE (˚C)
FIGURE 2-4: Supply Current vs. Temperature.
50
VOD = 20 mV
40
VOD = 100 mV
VOD = 200 mV
30
20
10
0
–40
–20
TCM81xL/M
0
20
40
TEMPERATURE (˚C)
60
85
FIGURE 2-5: Power-Down Reset Delay vs.
Temperature.
50
TCM81x/R/S/T
40
30
20
VOD = 200 mV
VOD = 100 mV VOD = 20 mV
10
0
–40
–20
0
20
40
TEMPERATURE (˚C)
60
85
FIGURE 2-6: Power-Down Reset Delay vs.
Temperature.
DS21615C-page 4
© 2007 Microchip Technology Inc.
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