TDA2003AV View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TDA2003AV Datasheet PDF : 19 Pages
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Application information
TDA2003A
3.1.7
Thermal shutdown
The presence of a thermal limiting circuit offers the following advantages:
1. An overload on the output (even if it is permanent), or an excessive ambient
temperature can be easily withstood.
2. The heatsink can have a smaller factor compared with that of a conventional circuit.
There is no damage to the device in the case of excessive junction temperature: only
Po (and therefore Ptot) and Id are reduced.
Figure 24. Output power and drain current vs. Figure 25. Output power and drain current vs.
case temperature (RL = 4 Ω)
case temperature (RL = 2 Ω)
3.2
3.2.1
3.2.2
Practical considerations
Printed circuit board
The layout shown in Figure 21 is recommended. If different layouts are used, the ground
points of input 1 and input 2 must be well decoupled from the ground of the output through
which a rather high current flows.
Assembly recommendations
No electrical insulation is required between the package and the heatsink. Pin length should
be as short as possible. The soldering temperature must not exceed 260 °C for 12 seconds.
14/19
Doc ID 018796 Rev 4
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