TDA7269SA View Datasheet(PDF) - STMicroelectronics
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TDA7269SA Datasheet PDF : 11 Pages
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TDA7269SA
5 HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is im-
portant the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (RTh j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
5.1 Example:
VCC = ±14V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C
Pdmax = (N° channels) · Π------22----V⋅---R-c---cl--o2---a---d- + Iq ⋅ Vcc
Pdmax = 2 · ( 4.96 ) + 0.84 = 10.7 W
(Heat Sinker) RTh c-a = 1----5---0-----–P-----dT----am---m-a---xb-----m----a--x- – RTh j-c = 1----5--1-0--0---–-.-7---5---0-- – 3.9 = 5.4°C/W
In figure 7 is shown the Power derating curve for the device.
Figure 10. Power derating curve
25
20
15
10
5
0
0
(a)
(b)
(c)
a) Infinite Heatsink
b) 5.0 °C/ W
c) 7.0 °C/ W
40
80
120
160
Tamb (°C)
7/11
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