TDA8922 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
TDA8922 Datasheet PDF : 36 Pages
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Philips Semiconductors
2 × 25 W class-D power amplifier
Objective specification
TDA8922
16.11 Bill of materials for reference design
Table 1 Single-chip class-D audio amplifier printed-circuit board (PCB version 4; 1-2002) for TDA8922TH
(see Figs 10 and 11).
BOM ITEM QUANTITY
REFERENCE
PART
DESCRIPTION
1
1
U1
TDA8922TH
Philips Semiconductors B.V.
2
2
in1 and in2
cinch inputs
Farnell 152-396
3
2
out1 and out2
output connector
Augat 5KEV-02
4
1
VDD, GND and VSS
supply connector
Augat 5KEV-03
5
2
L6 and L5
27 µH
EP13 or 16RHBP
6
4
L1, L2, L3 and L4
BEAD
Murata BL01RN1-A62
7
1
S1
PCB switch
Knitter ATE1E M-O-M
8
1
Z1
9
2
C1 and C2
10
3
C3, C4 and C5
5V6
470 µF; 35 V
47 µF; 63 V
BZX 79C5V6 DO-35
Panasonic M series
ECA1VM471
Panasonic NHG series
ECA1JHG470
11
6
C16, C17, C18, C19, C26 and 470 nF; 63 V
C27
MKT EPCOS B32529-C474-K
12
9
C8, C9, C11, C14, C28, C29, 220 nF; 63 V
C32, C35 and C38
SMD 1206
13
10
C6, C7, C10, C12, C13, C15, 100 nF; 50 V
C34, C36, C37 and C39
SMD 0805
14
2
C20 and C21
330 pF; 50 V
SMD 0805
15
4
C22, C23, C30 and C31
15 nF; 50 V
SMD 0805
16
2
C24, C25
560 pF; 100 V
SMD 0805
17
1
C33
47 pF; 25V
SMD 0805
18
2
R4 and R3
19
1
R5
20
1
R1
21
1
R2
22
4
R6, R7, R8 and R9
23
2
R13 and R12
24
2
R10 and R11
25
2
J1 and J2
39 kΩ; 0.1 W
SMD 0805
30 kΩ; 0.1 W
SMD 1206
10 kΩ; 0.1 W; optional SMD 0805
9.1 kΩ; 0.1 W; optional SMD 0805
5.6 kΩ; 0.1 W
SMD 0805
22 Ω; 1 W
SMD 2512
4.7 Ω; 0.25 W
SMD 1206
solder dot jumpers for ground reference in case of hum
(60 Hz noise)
26
2
J3 and J4
wire jumpers for BTL application
27
1
heatsink
30 mm SK400; OK for maximum music dissipation;
1/8 Prated (2 × 75 W/8) in 2 × 4 Ω at Tamb = 70 °C
28
1
printed-circuit board material 1.6 mm thick epoxy FR4 material, double sided 35 µm
copper; clearances 300 µm; minimum copper track
400 µm
2003 Mar 20
21
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