TDA8922 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

TDA8922

2×25 W class-D power amplifier

Philips Electronics 

Philips Semiconductors

2 × 25 W class-D power amplifier

Objective specification

TDA8922

CONTENTS

1

2

3

4

5

6

7

8

8.1

8.2

8.3

8.3.1

8.3.2

8.3.3

8.3.4

8.4

9

10

11

12

13

14

15

16

16.1

16.2

16.3

16.4

16.5

16.6

16.7

16.8

16.9

16.10

16.11

16.12

16.13

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

General

Pulse width modulation frequency

Protections

Overtemperature

Short-circuit across loudspeaker terminals and

to supply lines

Start-up safety test

Supply voltage alarm

Differential audio inputs

LIMITING VALUES

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

STATIC CHARACTERISTICS

SWITCHING CHARACTERISTICS

DYNAMIC AC CHARACTERISTICS (STEREO

AND DUAL SE APPLICATION)

DYNAMIC AC CHARACTERISTICS (MONO

BTL APPLICATION)

APPLICATION INFORMATION

BTL application

Pin MODE

Output power estimation

External clock

Heatsink requirements

Output current limiting

Pumping effects

Reference design

PCB information for HSOP24 package

Classification

Bill of materials for reference design

Curves measured in reference design

Application schematics

17

18

18.1

18.2

18.2.1

18.2.2

18.3

18.3.1

18.3.2

18.3.3

18.4

19

20

21

PACKAGE OUTLINE

SOLDERING

Introduction

Through-hole mount packages

Soldering by dipping or by solder wave

Manual soldering

Surface mount packages

Reflow soldering

Wave soldering

Manual soldering

Suitability of IC packages for wave, reflow and

dipping soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

2003 Mar 20

2

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