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TDA8777HL/24/C1 View Datasheet(PDF) - Philips Electronics

Part Name
Description
Manufacturer
TDA8777HL/24/C1 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Functional description . . . . . . . . . . . . . . . . . . . 5
8.1
Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5
8.2
Blanking and sync pulse insertion . . . . . . . . . . 6
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
10
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12
Application information. . . . . . . . . . . . . . . . . . 10
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
14.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
14.5
Package related soldering information . . . . . . 14
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 11 April 2006
Document identifier: TDA8777_4

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