TDA8922CTH/N1,112 View Datasheet(PDF) - NXP Semiconductors.
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Description
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TDA8922CTH/N1,112 Datasheet PDF : 40 Pages
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NXP Semiconductors
TDA8922C
2 × 75 W class-D power ampliï¬er
The most effective way to avoid pumping effects is to connect the TDA8922C in a mono
full-bridge conï¬guration. In the case of stereo single-ended applications, it is advised to
connect the inputs in anti-phase (see Section 8.4 on page 11). The power supply can also
be adapted; for example, by increasing the values of the supply line decoupling
capacitors.
13.7 Application schematic
Notes on the application schematic:
• Connect a solid ground plane around the switching ampliï¬er to avoid emissions
• Place 100 nF capacitors as close as possible to the TDA8922C power supply pins
• Connect the heatsink to the ground plane or to VSSPn using a 100 nF capacitor
• Use a thermally conductive, electrically non-conductive, Sil-Pad between the
TDA8922C heat spreader and the external heatsink
• The heat spreader of the TDA8922C is internally connected to VSSD
• Use differential inputs for the most effective system level audio performance with
unbalanced signal sources. In case of hum due to floating inputs, connect the
shielding or source ground to the ampliï¬er ground.
TDA8922C_1
Product data sheet
Rev. 01 — 7 September 2009
© NXP B.V. 2009. All rights reserved.
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