TPS72501
TPS72515, TPS72516
TPS72518, TPS72525
SLVS341D – MAY 2002 – REVISED MARCH 2004
THERMAL INFORMATION (continued)
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180
No Air Flow
160
140
120
100
80
60
40
20
0
0.1
1
10
PCB Copper Area − in2
Figure 24. SOT223 Thermal Resistance vs PCB AREA
From the data in Figure 24 and rearranging Equation 6, the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed (as shown in Figure 25).
6
TA = 25°C
5
4
4 in2 PCB Area
3
2
0.5 in2 PCB Area
1
0
0
25
50
75 100 125 150
TA − Ambient Temperature − °C
Figure 25. SOT223 Power Dissipation
14