NXP Semiconductors
TEA152x
SMPS ICs for low-power systems
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
y
Z
14
pin 1 index
1
e
E
A
X
c
HE
vM A
8
A2
A1
7
bp
wM
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT108-1
IEC
076E06
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT108-1 (SO14)
TEA152X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 14 September 2010
© NXP B.V. 2010. All rights reserved.
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