TLP718 View Datasheet(PDF) - Toshiba
Part Name
Description
Manufacturer
TLP718 Datasheet PDF : 9 Pages
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TOSHIBA PHOTOCOUPLER IRED & PHOTO-IC
TLP718
Isolated Bus Drivers
High Speed Line Receivers
Microprocessor System Interfaces
4.58±0.25
654
TLP718
Unit: mm
The Toshiba TLP718 consists of an infrared emitting diode and an integrated
high-gain, high-speed photodetector. This unit is a 6-pin SDIP. The TLP718 is
50% smaller than the 8-PIN DIP and meets the reinforced insulation class
requirements of international safety standards. Therefore the mounting area can
be reduced in equipment requiring safety standard certification.
The detector has a totem pole output stage to provide both source and sink
driving. The detector IC has an internal shield that provides a guaranteed
common-mode transient immunity of 10 kV/μs.
The TLP718 is inverter logic type. For buffer logic type, the TLP715 is in line-
up.
123
1.27±0.2
7.62±0.25
1.25±0.25
Inverter logic type (totem pole output)
0.4±0.1
9.7±0.3
Guaranteed performance over temperature : −40 to 100°C
Power supply voltage : 4.5 to 20 V
Input current: IFHL = 3 mA (max)
Switching time ( tpHL / tpLH) : 250 ns (max)
Common-mode transient immunity : ±10 kV/μs (min)
Isolation voltage : 5000 Vrms (min)
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A
File No.E67349
VDE-approved: EN 60747-5-5 , EN 62368-1 (Note1)
TOSHIBA
11-5J1S
Weight: 0.26 g (typ.)
Pin Configuration (Top View)
1
VCC 6 1: ANODE
2: N.C.
2
5 3: CATHODE
4: GND
GND
3
SHIELD
4 5: VO (Output)
6: VCC
Note 1 : When a VDE approved type is needed,
please designate the Option(D4).
Construction Mechanical Rating
7.62 mm pitch
standard type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
10.16 mm pitch
TLPXXXF type
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
Truth Table
Input LED Tr1 Tr2 Output
H
ON OFF ON
L
L OFF ON OFF H
© 2019
1
Toshiba Electronic Devices & Storage Corporation
Schematic
IF
1+
VF
3-
ICC
VCC
6 (Note)
Tr1
IO
VO
Tr2
5
SHIELD
GND
4
Note: 0.1 μF bypass capacitor must be connected
between pins 6 and 4.
Start of commercial production
2008-12
2019-06-03
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