CXL5506M View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
Manufacturer
CXL5506M Datasheet PDF : 9 Pages
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Package Outline
Unit: mm
CXL5506M
+ 0.4
6.1 – 0.1
8
5
8PIN SOP (PLASTIC)
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1– 0.05
1
0.45 ± 0.1
4
1.27
+ 0.1
0.2 – 0.05
0.24 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-8P-L01
SOP008-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
42/COPPER ALLOY
0.1g
CXL5506P
8PIN DIP (PLASTIC)
+ 0.4
9.4 – 0.1
8
5
1
4
2.54
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-8P-01
DIP008-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.5g
–9–
CXL5506M/P
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