TPS859 View Datasheet(PDF) - Toshiba
Part Name
Description
Manufacturer
TPS859 Datasheet PDF : 13 Pages
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Mounting Methods
(1) Example of reflow soldering
TPS859
190°C
180°C
4°C/s max (*)
4°C/s max (*)
10s max (*)
260°C max (*)
230°C
Preheating part
60 s to 120 s
30 s to 50 s Heating part
Time (s) →
(*)The product is evaluated using above reflow soldering conditions. No additional test is performed
exceed the condition (i.e. the condition more than MAX values) as an evaluation.
Please perform reflow soldering under the above conditions. Perform reflow soldering no more than
twice.
• Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
• Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 70% RH or lower
• Do not perform flow soldering.
• Make any necessary soldering correction manually.
(Do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
(2) Recommended soldering pattern
0.3
Unit: mm
1.0
0.5 0.5
(3) Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 min
Ultrasonic cleaning: 300 W or less
6
2008-05-13
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