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TS2007 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TS2007 Datasheet PDF : 29 Pages
First Prev 21 22 23 24 25 26 27 28 29
Package information
5
Package information
TS2007
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 52. Pinout (top view)
1
8
2
7
3
6
4
5
Figure 53. Marking (top view)
Logo: ST
Part number: K007
Three digit date code: YWW
The dot is for marking pin 1
Figure 54. Recommended footprint for the TS2007 DFN8 package
1.8 mm
0.8 mm
0.35 mm
2.2 mm
1.4 mm
0.65 mm
26/29
Doc ID 13123 Rev 4

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