TS4962(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TS4962 Datasheet PDF : 46 Pages
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TS4962
DFN8 package information
Figure 71. DFN8 3x3 exposed pad package
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
A
0.50
0.60
0.65
19.70
A1
0.02
0.05
A2
0.40
A3
0.15
0.22
b
0.25
0.30
0.35
9.85
D
2.85
3.00
3.15
112.20
D2
1.60
1.70
1.80
63.00
E
2.85
3.00
3.15
112.20
E2
1.10
1.20
1.30
43.30
e
0.65
L
0.50
0.55
0.60
19.70
Mils
Typ.
23.62
0.79
15.75
5.90
11.81
118.10
66.93
118.10
47.25
25.60
21.65
Max.
25.60
1.97
8.67
13.78
124.00
70.87
124.00
51.18
23.62
Note:
DFN8 exposed pad (e2 x d2) is connected to pin number 7.
For enhanced thermal performance, the exposed pad must be soldered to a copper area on
the PCB, acting as heatsink. This copper area can be electrically connected to pin7 or left
floating.
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