TS4962 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TS4962 Datasheet PDF : 44 Pages
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TS4962
Package information
Figure 71. DFN8 3 x 3 exposed pad package mechanical drawing (pitch 0.65 mm)
Table 12. DFN8 3 x 3 exposed pad package mechanical data (pitch 0.65 mm)
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.65
0.020
0.024
0.026
A1
0.02
0.05
0.0008
0.002
A3
0.22
0.009
b
0.25
0.30
0.35
0.010
0.012
0.014
D
2.85
3.00
3.15
0.112
0.118
0.124
D2
1.60
1.70
1.80
0.063
0.067
0.071
E
2.85
3.00
3.15
0.112
0.118
0.124
E2
1.10
1.20
1.30
0.043
0.047
0.051
e
0.65
0.026
L
0.50
0.55
0.60
0.020
0.022
0.024
ddd
0.08
0.003
Note: 1 The pin 1 identifier must be visible on the top surface of the package by using an indentation
mark or other feature of the package body. Exact shape and size of this feature are optional.
2 The dimension L does not conform with JEDEC MO-248, which recommends
0.40+/-0.10 mm.
For enhanced thermal performance, the exposed pad must be soldered to a copper area on
the PCB, acting as a heatsink. This copper area can be electrically connected to pin 7 or left
floating.
Doc ID 10968 Rev 8
41/44
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