TS507 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TS507 Datasheet PDF : 20 Pages
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TS507
4
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
4.1
SOT23-5 package information
Figure 31. SOT23-5 package mechanical drawing
Table 7.
Ref.
A
A1
A2
b
C
D
E
E1
e
e1
L
SOT23-5 package mechanical data
Dimensions
Millimeters
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
Min.
35.4
0.00
35.4
13.7
3.5
110.2
102.3
59.0
0.55
13.7
Mils
Typ.
37.4
74.8
Max.
57.1
5.9
51.2
19.7
7.8
118.1
118.1
68.8
21.6
17/20
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