µ PD16434
13. RECOMMENDED SOLDERING CONDITIONS
When mounting the µ PD16434 by soldering should be performed under the following recommended conditions.
Should other than recommended conditions be used, consult with our sales personnel.
Surface Mount Type
µ PD16434G-xxx-12 : 80-PIN PLASTIC QFP (14 × 20)
5 µ PD16434GF-xxx-3B9: 80-PIN PLASTIC QFP (14 × 20)
Soldering Method
Soldering Condition
Infrared reflow
VPS
Wave soldering
5 Partial heating
Package peak temperature : 235 °C, Time : 30 seconds MAX. (210 MIN.),
Number of times : 2 MAX.
Package peak temperature : 235 °C, Time : 40 seconds MAX. (200 MIN.),
Number of times : 2 MAX.
Solder path temperature : 260 °C MAX., Time : 10 seconds MAX.,
Number of times : 1,
Preheating temperature : 120 °C MAX. (Package sutface)
Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per side of device)
Symbol of Recommended
Soldering Condition
IR35-00-2
VP-15-00-2
WS-60-00-1
−
Caution Do not use two or more soldering methods in combination (except the partial heating method).
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Data Sheet S10299EJ4V0DS00