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VNQ810M-E View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
VNQ810M-E
ST-Microelectronics
STMicroelectronics ST-Microelectronics
VNQ810M-E Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
VNQ810M-E
Figure 4. Current and Voltage Conventions
IS3,4
VCC3,4
IIN1
VIN1
ISTAT1
VSTAT1
IIN2
VIN2
ISTAT2
VSTAT2
IIN3
VIN3
ISTAT3
VSTAT3 IIN4
VIN4 ISTAT4
VSTAT4
VCC3,4 VCC1,2
IS1,2
VF1 (*)
VCC1,2
INPUT1
STATUS1
INPUT2
STATUS2
INPUT3
STATUS3
INPUT4
STATUS4
GND3,4
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
GND1,2
IOUT1
IOUT2
VOUT1
IOUT3
VOUT2
IOUT4 VOUT3
VOUT4
IGND3,4
IGND1,2
(*) VFn = VCCn - VOUTn during reverse battery condition
Table 4. Thermal Data (Per island)
Symbol
Rthj-lead
Rthj-amb
Rthj-amb
Parameter
Thermal Resistance Junction-lead per chip
Thermal Resistance Junction-ambient (one chip ON)
Thermal Resistance Junction-ambient (two chips ON)
Value
20
60 (1)
44 (2)
46 (1)
31 (2)
Unit
°C/W
°C/W
°C/W
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow
Note: 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow
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