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VNQ860 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
VNQ860
STMICROELECTRONICS
STMicroelectronics STMICROELECTRONICS
VNQ860 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
Package mechanical data
9
Package mechanical data
VNQ860-E, VNQ860SP-E
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 11.
Dim.
A
A1
B
c
D
D1
E
E1
E2
E3
E4
e
F
H
h
L
q
a
PowerSO-10™ mechanical data
mm
Min
Typ
Max
3.35
3.65
0.00
0.10
0.40
0.60
0.35
0.55
9.40
9.60
7.40
7.60
9.30
9.50
7.20
7.40
7.20
7.60
6.10
6.35
5.90
6.10
1.27
1.25
1.35
13.80
14.40
0.50
1.20
1.80
1.70
Min
0.132
0.000
0.016
0.013
0.370
0.291
0.366
0.283
0.283
0.240
0.232
0.049
0.543
0.047
inch
Typ
0.050
0.002
0.067
Max
0.144
0.004
0.024
0.022
0.378
0.300
0.374
0.291
0.300
0.250
0.240
0.053
0.567
0.071
12/19

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