W83176G-735 View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W83176G-735

3 DIMM DDR ZERO DELAY BUFFER

Winbond 

W83176R-735/W83176G-735

3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET

8. ORDERING INFORMATION

PART NUMBER

W83176R-735

PACKAGE TYPE

48 PIN SSOP

W83176G-735

48 PIN SSOP (Pb-free

package)

PRODUCTION FLOW

Commercial, 0°C to +70°C

Commercial, 0°C to +70°C

9. HOW TO READ THE TOP MARKING

W83176R-735

28051234

342GB

W83176G-735

28051234

342GB

1st line: Winbond logo and the type number: W83176R-735/W83176G-735.

2nd line: Tracking code 2 8051234

2: wafers manufactured in Winbond FAB 2

8051234: wafer production series lot number

3rd line: Tracking code 342 G B

342: packages made in '2003, week 42

G: assembly house ID; O means OSE, G means GR

B: IC revision

All the trade marks of products and companies mentioned in this data sheet belong to their

respective owners.

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