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WCMC1616V9X View Datasheet(PDF) - Weida Semiconductor, Inc.

Part Name
Description
Manufacturer
WCMC1616V9X
WEIDA
Weida Semiconductor, Inc. WEIDA
WCMC1616V9X Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Pin Configuration[2, 3, 4]
ADVANCE INFORMATION
WCMC1616V9X
FBGA
Top View
12 34 56
BLE OE A0 A1 A2 CE2 A
I/O8 BHE A3 A4 CE I/O0
B
I/O9 I/O10 A5 A6 I/O1 I/O2
C
VSS I/O11 A17 A7 I/O3 VCC
D
VCC I/O12 DNU A16 I/O4 VSS
E
I/O14 I/O13 A14 A15 I/O5 I/O6
F
I/O15 A19 A12 A13 WE I/O7
G
A18 A8 A9 A10 A11 NC
H
Note:
2. DNU pins are to be left floating or tied to Vss.
3. Ball H6 is the address expansion pin for the 32Mb density.
4. NC “no connect” - not connected internally to the die.
Document #: 38-14027 Rev. **
Page 2 of 13

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