MC100ELT25MNR4 View Datasheet(PDF) - ON Semiconductor

Part Name

Description

Manufacturer

MC100ELT25MNR4

−5 VDifferential ECL to TTL Translator

ON Semiconductor 

MC10ELT25, MC100ELT25

VEE 1

D2

D3

ECL

8 VCC

TTL 7 Q

6 NC

VBB 4

5 GND

Figure 1. 8−Lead Pinout (Top View) and Logic

Diagram

Table 1. PIN DESCRIPTION

Pin

Function

D, D

ECL Differential Inputs

Q

TTL Output

VBB

VCC

VEE

GND

Reference Voltage Output

Positive Supply

Negative Supply

Ground

NC

No Connect

EP

Exposed pad must be connected to a sufficient

thermal conduit. Electrically connect to the most

negative supply or leave floating open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

SOIC−8

TSSOP−8

DFN8

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

75 kW

N/A

> 1 kV

> 400 V

Pb Pkg

Pb−Free Pkg

Level 1

Level 1

Level 1

Level 1

Level 3

Level 1

UL 94 V−0 @ 0.125 in

38 Devices

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

Positive Power Supply

GND = 0 V

VEE

Negative Power Supply

GND = 0 V

VIN

Input Voltage

GND = 0 V

IBB

VBB Sink/Source

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

VEE = −5.0 V

VCC = +5.0 V

SOIC−8

SOIC−8

7

−8

0 to VEE

± 0.5

−40 to +85

−65 to +150

190

130

V

V

V

mA

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

SOIC−8

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

TSSOP−8

DFN8

DFN8

41 to 44 ± 5%

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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