XE0092 View Datasheet(PDF) - Unspecified

Part Name

Description

Manufacturer

XE0092

Surface-Mount DAA Module

Unspecified 

Cermetek Microelectronics, Inc

XE0092 Surface-Mount Soldering Instructions

XE0092 Low-cost DAA Module

The XE0092 is subject to damage if over-exposed to heat during solder reflow operations. Following the soldering

instructions below will ensure that the process of soldering the module to the board does not damage the modem.

Maximum Temperature 250° C

Maximum Time above 235° C 15 Seconds

Maximum Time in reflow zone (217° C) 90 Seconds

Maximum Preheat Dwell Time 180 Seconds

XE0092 Maximum Solder Temperature Profile

235°C

217°C

150°C

Preheat Dwell Time 180 sec max

Time above 235°

15 sec

Time in Reflow

90 sec max

©2009 Cermetek Microelectronics, Inc.

Page 6

Document No. 607-0100 Revision A (10/09)

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