XL1003-BD View Datasheet(PDF) - Mimix Broadband

Part Name

Description

Manufacturer

XL1003-BD

24.0-40.0 GHz GaAs MMIC Low Noise Amplifier

Mimix Broadband 

24.0-40.0 GHz GaAs MMIC

Low Noise Amplifier

April 2007 - Rev 19-Apr-07

Mechanical Drawing

1.370

(0.054)

1.660

(0.065)

2

L1003-BD

0.675

1

(0.027)

0.0

0.0

3

0.321

(0.013)

2.100

(0.083)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.784 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd)

Bond Pad #3 (RF Out)

Bias Arrangement

Bypass Capacitors - See App Note [2]

Vd

2

RF In 1

3 RF Out

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 4 of 6

Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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