VND810
THERMAL DATA
Symbol
Rthj-lead
Rthj-amb
Parameter
Thermal Resistance Junction-lead
Thermal Resistance Junction-ambient
Value
15
75 (*)
Unit
°C/W
°C/W
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow.
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C < Tj <150°C, unless otherwise specified)
(Per each channel)
POWER OUTPUTS
Symbol
Parameter
Test Conditions
Min Typ Max Unit
VCC (**) Operating Supply Voltage
5.5
13
36
V
VUSD (**) Under Voltage Shut-down
3
4
5.5
V
VOV (**) Overvoltage Shut-down
36
V
RON On State Resistance
IOUT=1A; Tj=25°C
IOUT=1A; VCC>8V
160
mΩ
320
mΩ
Off State; VCC=13V; VIN=VOUT=0V
12
40
µA
IS (**) Supply Current
Off State; VCC=13V; VIN=VOUT=0V;
Tj=25°C
12
25
µA
On State; VCC=13V; VIN=5V; IOUT=0A
5
7
mA
IL(off1) Off State Output Current VIN=VOUT=0V
0
50
µA
IL(off2) Off State Output Current VIN=0V; VOUT=3.5V
-75
0
µA
IL(off3) Off State Output Current VIN=VOUT=0V; Vcc=13V; Tj =125°C
5
µA
IL(off4) Off State Output Current VIN=VOUT=0V; Vcc=13V; Tj =25°C
3
µA
(**) Per device
SWITCHING (VCC=13V)
Symbol
Parameter
td(on) Turn-on Delay Time
td(off)
Turn-off Delay Time
dVOUT/dt(on) Turn-on Voltage Slope
dVOUT/dt(off) Turn-off Voltage Slope
Test Conditions
RL=13Ω from VIN rising edge to
VOUT=1.3V
RL=13Ω from VIN falling edge to
VOUT=11.7V
RL=13Ω from VOUT=1.3V to
VOUT=10.4V
RL=13Ω from VOUT=11.7V to
VOUT=1.3V
Min Typ Max Unit
30
µs
30
See
relative
diagram
See
relative
diagram
µs
V/µs
V/µs
LOGIC INPUT
Symbol
VIL
IIL
VIH
IIH
VI(hyst)
Parameter
Input Low Level
Low Level Input Current
Input High Level
High Level Input Current
Input Hysteresis Voltage
VICL Input Clamp Voltage
Test Conditions
VIN = 1.25V
VIN = 3.25V
IIN = 1mA
IIN = -1mA
Min Typ Max Unit
1.25
V
1
µA
3.25
V
10
µA
0.5
V
6
6.8
8
V
-0.7
V
3/19
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