SP5002-06TTG View Datasheet(PDF) - Littelfuse, Inc

Part Name

Description

Manufacturer

SP5002-06TTG

TVS Diode Arrays (SPA®Diodes) Low Capacitance ESD Protection

Littelfuse, Inc 

TVS Diode Arrays (SPA® Diodes)

Low Capacitance ESD Protection - SP5002 Series

Product Characteristics

Lead Plating

Lead Material

Substrate material

Body Material

Pre-Plated Frame

Copper Alloy

Silicon

V-0 per UL 94 Molded Epoxy

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

Part Numbering System

SP 5002– 06T T G

TVS Diode Arrays

(SPA® Diodes )

G= Green

Series

Number of Channels

06 = 6 Channel TDFN-16

T= Tape & Reel

Package

TDFN-16 (4.0x2.0mm)

Ordering Information

Part Number Package

Size

Marking

SP5002-06TTG TDFN-16 4.0x2.0mm C33****

Min.

Order

Qty.

3000

Part Marking System

C33 ****

Product Series

C33 = SP5002

Date Code

(Year / Week)

Package Dimensions — TDFN-16

D

AB

L

L

2 X 0.10 C

L1

PIN 1

REFERENCE

2 X 0.10 C

TOP VIEW

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

EXPOSED Cu

MOLD CMPD

A3

0.05 C

0.05 C

DETAIL B

SIDE VIEW

A3

A

A1

C

A1

DETAIL B

ALTERNATE CONSTRUCTIONS

DETAIL A

1

8

TDFN-16

JEDEC MO-229

Millimeters

Inches

Min Max Min Max

A 0.70 0.80 0.028 0.031

A1 0.00 0.05 0.00 0.002

A3 0.20 REF

0.008 REF

b 0.15 0.25 0.006 0.010

D 3.95 4.05 0.156 0.159

E 1.95 2.05 0.077 0.081

e 0.50 BSC

0.020 BSC

L 0.70 0.90 0.028 0.035

L1 0.05 0.15 0.002 0.006

0.10

MIN

12X L

16

e

e/2

9

14X b

0.10 M C A B

0.05 M C

BOTTOM VIEW

0.2

0.5

TDFN-16 Soldering Pattern

RECOMMENDED SOLDER

PAD LAYOUT

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 08/30/17

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