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298D225X0016M2T(2007) View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
Manufacturer
298D225X0016M2T
(Rev.:2007)
Vishay
Vishay Semiconductors Vishay
298D225X0016M2T Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Solid Tantalum Chip Capacitors
MICROTANTM Lead Frameless Molded
298D
Vishay Sprague
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD 202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD 202G Method 103B
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Thermal Shock
At - 55 °C/+ 125 °C, 30 min. each,
for 5 cycles. MIL-STD 202G Method 107G
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 ± 1 s
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Substrate Bending
(Board flex)
Vibration
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G Peak
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Shock
Mil-Std-202G, Method 213B, Condition I,
100G Peak
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Resistance to Solder At 260 °C, for 10 seconds, reflow
Heat
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Solderability
Resistance to
Solvents
Flammability
There shall be no mechanical or visual damage to capacitors
post-conditioning.
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to Solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Encapsulation materials meet UL94 VO with an
oxygen index of 32 %.
www.vishay.com
41
For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 22-Oct-07

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