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STP16CP05XTTR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STP16CP05XTTR Datasheet PDF : 30 Pages
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Electrical ratings
STP16CP05
2
2.1
2.2
Electrical ratings
Absolute maximum ratings
Stressing the device above the ratings listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other condition above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Symbol
Table 4: Absolute maximum ratings
Parameter
Value
Unit
VDD Supply voltage
VO Output voltage
IO
Output current
VI
Input voltage
IGND GND terminal current
fCLK Clock frequency
TJ
Junction temperature range
0 to 7
-0.5 to 20
100
-0.4 to VDD
1600
50
-40 to +170
V
V
mA
V
mA
MHz
°C
Thermal data
Symbol
Table 5: Thermal data
Parameter
TOPR
TSTG
Operating temperature range
Storage temperature range
RthJA Thermal resistance junction-ambient (1)
SO-24
TSSOP24
TSSOP24 (2)
exposed pad
QSOP-24
Value
Unit
-40 to +125 °C
-55 to +150 °C
42.7
°C/W
55
°C/W
37.5
°C/W
55
°C/W
Notes:
(1) According with JEDEC standard 51-7.
(2) The exposed pad should be soldered directly to the PCB to realize the thermal benefits.
4/30
DocID12568 Rev 13

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