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SMA02070C8259FD500 View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
Manufacturer
SMA02070C8259FD500
Vishay
Vishay Semiconductors Vishay
SMA02070C8259FD500 Datasheet PDF : 13 Pages
First Prev 11 12 13
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
Vishay Beyschlag
Professional Thin Film Leaded Resistors
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R max.)
Stability for product
types:
STABILITY
CLASS 0.5
STABILITY
CLASS 1
STABILITY
CLASS 2
MBA/SMA 0204
1 to 332 k
0.22 to < 1
> 332 k
MBB/SMA 0207
1 to 1 M
0.22 to < 1
> 1 M
MBE/SMA 0414
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.13
4.19
4.29
4.18.2
4.17
4.22
4.16
4.7
4.40
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
14 (Na)
45 (XA)
20 (Tb)
20 (Ta)
6 (B4)
21 (Ua1)
21 (Ub)
21 (Uc)
-
-
Climatic
sequence:
Dry heat
Damp heat,
cyclic
Cold
Low air
pressure
Damp heat,
cyclic
Short time
overload
Rapid change
of temperature
Component
solvent
resistance
Resistance to
soldering heat
Solderability
Vibration
155 °C; 16 h
55 °C; 24 h;
90 % to 100 % RH;
1 cycle
- 55 °C; 2 h
8.5 kPa; 2 h;
15 °C to 35 °C
55 °C; 5 days;
95 % to 100 % RH;
5 cycles
Room temperature;
U
=
U
2.5
=2
x
x
UPm7a0x.x;
R or
5s
30 min at LCT = - 55 °C
30 min at UCT= 155 °C
5 cycles
MBA/SMA 0204:
500 cycles
MBB/SMA 0207:
200 cycles
MBE/SMA 0414:
100 cycles
Isopropyl alcohol
+ 23 °C; toothbrush
method
Unmounted
components;
(260 ± 3) °C;
(10 ± 1) s
+ 235 °C; 2 s
solder bath method;
SnPb40
+ 245 °C; 3 s
solder bath method;
SnAg3Cu0.5
6 h; 10 Hz to 2000 Hz
1.5 mm or 196 m/s2
Robustness of Tensile, bending and
terminations
torsion
Voltage proof
Electrostatic
discharge
(human body
model)
URMS = Uins; 60 s
IEC 61340-3-1;
3 pos. + 3 neg.
MBA/SMA 0204: 2 kV
MBB/SMA 0207: 4 kV
MBE/SMA 0414: 6 kV
Note
(1) ± (0.4 % R + 0.05 ) for MBE/SMA 0414
(2) ± (0.8 % R + 0.05 ) for MBE/SMA 0414
(3) ± (0.2 % R + 0.05 ) for MBE/SMA 0414
(4) ± (0.4 % R + 0.05 ) for MBE/SMA 0414
1 to 2.4 M
0.22 to < 1
> 2.4 M
± (0.5 % R + 0.05 )
no visible
damage
± (0.1 % R + 0.01)
no visible
damage
± (1 % R + 0.05 )
no visible
damage
± (0.25 % R + 0.05 )
no visible
damage
± (0.1 % R + 0.01 ) ± (0.25 % R + 0.05 )
± 2 %R
no visible
damage
± 0.5 % R
no visible
damage
± 0.5 % R
± (0.5 % R + 0.05 ) ± (0.5 % R + 0.05 ) ± (0.5 % R + 0.05 )
Marking legible;
no visible damage
± (0.1 % R + 0.01 )
no visible
damage
± (0.25 % R + 0.05 )
no visible
damage
± 0.5 % R
no visible
damage
Good tinning (> 95 % covered, no visible damage)
± (0.1 % R + 0.01 ) ± (0.25 % R + 0.05 )
± (0.1 % R + 0.01 ) ± (0.25 % R + 0.05 )
No flashover or breakdown
± (0.5 % R + 0.05 )
± 0.5 % R
± 0.5 % R
www.vishay.com
For technical questions, contact: filmresistorsleaded@vishay.com
Document Number: 28766
32
Revision: 03-Dec-12
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT\rARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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