ES6Y(2012) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ES6Y
(Rev.:2012)

Automotive quad Transil™ array for ESD protection

STMicroelectronics 

Recommendation on PCB assembly

ESDASCY

5.3

PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open

vias.

2. The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

5.4

Reflow profile

Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

0

30

60

90

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

120 150 180 210 240 270 300

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

10/12

Doc ID 022084 Rev 1

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