VSC7130RC(2000) View Datasheet(PDF) - Vitesse Semiconductor

Part Name

Description

Manufacturer

VSC7130RC
(Rev.:2000)

Dual Repeater/Retimer for Fibre Channel and Gigabit Ethernet

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

Advance Product Information

VSC7130

Dual Repeater/Retimer

for Fibre Channel and Gigabit Ethernet

Package Thermal Characteristics

The VSC7130 is packaged in an exposed pad, thin quad flatpack (TQFP) which adheres to industry stan-

dard EIAJ footprints for a 10x10x1.0mm body, 64 lead TQFP. The package construction is shown below. The

bottom of the leadframe is exposed so that it can be soldered to the printed circuit board and connected to the

ground plane. This provides excellent thermal characteristics and reduces electrical parasitics as well.

Figure 8: Package Cross Section

Wire Bond

Copper Lead Frame

Die

Plastic Molding Compound

Die Attach Epoxy

Grounded Down Bond

Exposed Pad

Table 8: 64-pin, Exposed Pad, TQFP Thermal Resistance

Symbol

θca-0

θca-100

θca-200

θca-400

θca-600

Description

Thermal resistance from case to ambient, still air

Thermal resistance from case to ambient, 100 LFPM air

Thermal resistance from case to ambient, 200 LFPM air

Thermal resistance from case to ambient, 400 LFPM air

Thermal resistance from case to ambient, 600 LFPM air

Value

30

25

23

21

20

Units

oC/W

oC/W

oC/W

oC/W

oC/W

The VSC7130 is designed to operate with a case temperature up to 95oC. The user must guarantee that the

case temperature specification is not violated. With the thermal resistances shown above, the VS7130 can oper-

ate in still air ambient temperatures of 70oC [ ~70oC = 95oC - 0.8W * 30 ]. If the ambient air temperature

exceeds these limits then some form of cooling through a heatsink or an increase in airflow must be provided.

Additional heat can be transferred to the printed circuit board by not using thermal reliefs on the power and

ground plane vias as well as using multiple vias to the power and ground planes.

If the exposed pad is not soldered to the printed circuit board and grounded, both thermal and electrical per-

formance will be degraded significantly.

Moisture Sensitivity Level

This device is rated at a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for appro-

priate handling procedures.

G52297-0, Rev. 2.3

1/17/00

© VITESSE SEMICONDUCTOR CORPORATION

741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896

Page 19

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