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BAS16 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
BAS16
NXP
NXP Semiconductors. NXP
BAS16 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
NXP Semiconductors
BAS16 series
High-speed switching diodes
2.75
2.45
2.1
1.6
0.538
2 1.7 1.075
0.55
(2×)
0.4
(6×) 0.25 0.3
(2×) (2×)
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
0.325 0.375
(4×) (4×)
Reflow soldering is the only recommended soldering method.
Fig 23. Reflow soldering footprint BAS16VV (SOT666)
solder lands
placement area
solder paste
occupied area
Dimensions in mm
sot666_fr
2.65
2.35 1.5 0.6 0.5
(4×) (4×)
0.4 (2×)
solder lands
solder resist
0.5
0.6
(4×)
(2×)
0.6
(4×)
1.8
solder paste
occupied area
Dimensions in mm
sot363_fr
Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88)
BAS16_SER_5
Product data sheet
Rev. 05 — 25 August 2008
© NXP B.V. 2008. All rights reserved.
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