Q67060-S7005-A2 View Datasheet(PDF) - Siemens AG

Part Name

Description

Manufacturer

Q67060-S7005-A2

Smart Four Channel Highside Power Switch

Siemens AG 

Maximum Ratings at Tj = 25°C unless otherwise specified

Parameter

Symbol

Load current (Short-circuit current, see page 5)

Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V

RI3) = 2 Ω, td = 200 ms; IN = low or high,

each channel loaded with RL = 4.7 Ω,

Operating temperature range

Storage temperature range

Power dissipation (DC)5

(all channels active)

Electrostatic discharge capability (ESD)

(Human Body Model)

Ta = 25°C:

Ta = 85°C:

Input voltage (DC)

Current through input pin (DC)

Current through status pin (DC)

see internal circuit diagram page 8

IL

VLoad dump4)

Tj

Tstg

Ptot

VESD

VIN

IIN

IST

Thermal resistance

junction - soldering point5),6)

junction - ambient5)

each channel: Rthjs

one channel active: Rthja

all channels active:

BTS720L1

Values Unit

self-limited A

60 V

-40 ...+150 °C

-55 ...+150

3.7 W

1.9

1.0 kV

-10 ... +16 V

±2.0 mA

±5.0

15 K/W

41

34

Electrical Characteristics

Parameter and Conditions, each of the four channels Symbol

at Tj = 25 °C, Vbb = 12 V unless otherwise specified

Values

Unit

min typ max

Load Switching Capabilities and Characteristics

On-state resistance (Vbb to OUT)

IL = 2 A

each channel, Tj = 25°C: RON

Tj = 150°C:

two parallel channels, Tj = 25°C:

four parallel channels, Tj = 25°C:

-- 85 100 mΩ

170 200

43 50

22 25

2) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a

150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for input

protection is integrated.

3) RI = internal resistance of the load dump test pulse generator

4) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839

5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb

connection. PCB is vertical without blown air. See page 14

6) Soldering point: upper side of solder edge of device pin 15. See page 14

Semiconductor Group

Page 3

26.Feb.96

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